Introducing FPGAi – Innovations Unlocked by AI-enabled FPGAs

FPGA-based prototyping is an essential tool for any SoC and digital chip design and verification. In this episode of Chalk Talk, Juergen Jaeger from Siemens and Amelia Dalton explore the multitude of benefits of the Veloce proFPGA CS platform from Siemens. They also investigate the debug capabilities, software prototyping and scalable hardware of this solution, and how you can use the Veloce proFPGA CS solution for your next design.

Global functionality for cellular enhanced applications can be a complicated process. In this episode of Chalk Talk, Alec Jahnke and Amelia explore the details and benefits of Digi’s XBee 3 Global LTE CAT 4 solution. We also investigate the XBee programming process and how the over the air updates of Digi Remote Manager can help future proof your next cellular design.

In this episode of Chalk Talk, Zobair Roohani from Infineon and Amelia Dalton explore the fundamentals and characteristics of wide band gap materials. They also investigate why the higher band gap and higher electric field withstanding capability of GaN brings us closer toward that ideal switching technology and the unique design challenges one must pay attention to when driving GaN devices.  

In this episode of Chalk Talk, Logan Lukasik from Molex and Amelia Dalton explore the benefits of Molex’s flat flexible cables and flexible printed circuits called Premo-Flex. They also investigate custom capabilities of the Premo-Flex solutions and how you can get started using Premo-Flex in your next design.

All major truck and bus OEMs will be launching electric vehicle platforms within the next few years and in order to keep pace with on-highway and off-highway EV innovation, our charging inlets must also provide the voltage, current and charging requirements needed for these vehicles. In this episode of Chalk Talk, Amelia Dalton and Drew Reetz from TE Connectivity investigate charging inlet design considerations for the next generation of industrial and commercial transportation, the differences between AC only charging and fast charge and high power charging inlets, and the benefits that TE Connectivity’s ICT high power charging inlets bring to these kinds of designs.

In this episode of Chalk Talk, Amelia Dalton and Christine Chacko from Texas Instruments explore a variety of power module package technologies, examine the many ways that power modules can help save on total design solution cost, and the unique benefits that Texas Instruments power modules can bring to your next design.